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Face recognition Android access control system circuit board OpenBOM pcb

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Face recognition Android access control system circuit board OpenBOM pcb

China Face recognition Android access control system circuit board OpenBOM pcb supplier

Large Image :  Face recognition Android access control system circuit board OpenBOM pcb

Product Details:

Place of Origin: china
Brand Name: dinglian
Model Number: 001

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Delivery Time: 5
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Detailed Product Description

General Information for High density pcb (HDI PCB)


HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

High Density PCB is used extensively in applications and industries including:

● Cell phone ● GPS
● Telecom ● ASemiconductor
● Automotive ● Military
● Medical ● Instrumentation

 

1. 6L HDI printed circuit board for Intercom

6L High density PCB (HDI PCB) for intercom
Board dimensions: 110 x 166mm
Finished board thickness: 1.2mm
Material: FR-4 Tg150
Minimum holes size: 0.1mm
Minimum line width/clearance: 3.5/3.5mil
Copper thickness: 1oz
Solder mask: top and bottom (color: green)
Silkscreen: top (color: white)
Finish: immersion gold (top and bottom)
Board stack up: 1 + 4 + 1

2. 8L Cell phone HDI board PCB

8layers High density PCB (HDI PCB) for cell phone
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling Impedance control
Stack up: 1+6+1

3. 10L High density printed circuit board

10layers HDI PCB
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control

4. 10L High Density Interconnect pcb

10L High Density Interconnect board
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Board stack up: 1+1+6+1+1
Application: Industry control

 

 

 

 

 

 

 

 

Tag:

pcb,

fpc,

mcpcb

Contact Details
DINGLIAN Electronics Technology Co., Ltd

Contact Person: Mrs. erika

Tel: 86-0755-36960450

Fax: 86-0755-36960450

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